ESI’s Interconnect & Micromachining Products are pushing the envelope to its greatest limit yet. As the market leader in UV laser drills, ESI has pioneered systems utilizing its breadth of core competencies from systems engineering to materials processing.

Utilizing its state-of-the-art Micromachining laser drills, ESI has expanded its applications to include High Density Interconnect (HDI), Flex Circuits, Flip Chip BGAs and machining of many other materials and substrates.